Screen Cleaning Vigon SC 200
Model No: SC 200
Boiling range 95-212 C
pH value(10g/|H20) Neutral
Cleaning Temperature 20-50 C
Vapour Pressure 18.1
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VIGON SC 200 is a water-based cleaning agent designed to clean SMT stencils at room temperature. Based on the MPC Technology, the cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in printers. It is designed for the use in spray-in-air and ultrasonic cleaning systems and is also recommended for cleaning misprinted solder paste. Depending on the type of fluxes, VIGON SC 200 can also be suggested for both double-sided and single-sided soldered circuit boards applications.

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Advantages compared to other cleaners:

  • High bath loading capability, very good filterability and therefore a long bath life as well as low maintenance costs.
  • Recommended for ambient cleaning temperatures
  • Water-based cleaner without flash point, no explosion-proof protection required.
  • Due to its mild formula, the medium shows excellent material compatibility with stencils.
  • Applicable in spray-in-air systems, ultrasonic dip tanks and printers
  • Applicable in closed-loop systems
  • No foaming when used in spray-in-air systems.
  • Low odor, no building of organics in the rinsing section



Technical Data 

VIGON SC 200 is available as concentrate or ready-to-use solution.

Please note that the information below represents VIGON SC 200 as a ready-to-use mixture.


(g/ccm) at 20°C/68°C


Surface tension

(mN/m) at 25°C/77°F


Boiling range


95 – 212 / 203 – 414

Flash point




10g/l H2O


Vapor pressure

(mbar) at 20°C/68°F


Solubility in water



Cleaning temperature


20 – 50 / 68 – 122

Application concentration



Application concentration1


25 %

HMIS Rating


0 – 0 – 0

1 VIGON® SC 200 is recommended to be diluted with DI-water only.