Screen Cleaning Vigon SC 200

Model No:	SC 200
Boiling range	95-212 C
pH value(10g/\|H20)	Neutral
Cleaning Temperature	20-50 C
Vapour Pressure	18.1
TDS:	Download
MSDS:	Download

VIGON SC 200 is a water-based cleaning agent designed to clean SMT stencils at room temperature. Based on the MPC Technology, the cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in printers. It is designed for the use in spray-in-air and ultrasonic cleaning systems and is also recommended for cleaning misprinted solder paste. Depending on the type of fluxes, VIGON SC 200 can also be suggested for both double-sided and single-sided soldered circuit boards applications.

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Advantages compared to other cleaners:

High bath loading capability, very good filterability and therefore a long bath life as well as low maintenance costs.
Recommended for ambient cleaning temperatures
Water-based cleaner without flash point, no explosion-proof protection required.
Due to its mild formula, the medium shows excellent material compatibility with stencils.
Applicable in spray-in-air systems, ultrasonic dip tanks and printers
Applicable in closed-loop systems
No foaming when used in spray-in-air systems.
Low odor, no building of organics in the rinsing section

Specification:

Technical Data VIGON SC 200 is available as concentrate or ready-to-use solution. Please note that the information below represents VIGON SC 200 as a ready-to-use mixture.
Density	(g/ccm) at 20°C/68°C	0.99
Surface tension	(mN/m) at 25°C/77°F	29.7
Boiling range	°C/°F	95 – 212 / 203 – 414
Flash point	°C/°F	None
pH-Value	10g/l H₂O	Neutral
Vapor pressure	(mbar) at 20°C/68°F	18.1
Solubility in water		Soluble
Cleaning temperature	°C/°F	20 – 50 / 68 – 122
Application concentration	Ready-to-use	Pure
Application concentration¹	Concentrate	25 %
HMIS Rating	Health-Flammability-Reactivity	0 – 0 – 0
¹VIGON® SC 200 is recommended to be diluted with DI-water only.