Screen Cleaning Vigon UC 160

Model No:	UC160
Boiling range	100 - 190
pH-value(10g/\|H2O)	Neutral
Cleaning Temperature	Room Temperature
Vapour Pressure	21.0
TDS:	Download

VIGON® UC 160 is a water-based cleaning agent specifically designed to remove solder paste from stencils in SMT printers. VIGON® UC 160 has an excellent wetting ability, which leads to an improved cleaning performance and thereby reduces smearing on the stencil underside significantly. This in turn prevents solder paste bridging on boards and ensures good and reliable printing results. VIGON® UC 160 is also an ideal replacement for Isopropanol due excellent health and safety characteristics, such as no flashpoint and a low VOC value.

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Advantages compared to other cleaners:

VIGON® UC 160 effectively removes the latest lead-free & lead-based solder pastes from stencils in underside wiping even out of fine pitch apertures. The cleaner is specifically suitable for print after wait.
Provides excellent wetting ability on stencils and therefore increased cleaning performance, which significantly reduces smearing on the stencil underside. Thus bridging of solder paste on the boards can be avoided.
Good delineation stability further ensures reduced solder balling.
High operational safety and ideal replacement for Isopropanol due to excellent health and safety characteristics, no flash point, low VOC levels.
VIGON® UC 160 has low odor.

Specification:

Technical Data
Density	(g/ccm) at 20°C/68°F	1.00
Surface tension	(mN/m) at 25°C/77°F	43.1
Boiling range	°C/°F	100-190°C/212-374°F
Flash point	°C/°F	None until boiling
pH-value	10g/l H₂O	Neutral
Vapor pressure	(mbar) 20°C/68°F	21.0
Cleaning temperature	°C/°F	Room Temperature
Application concentration	Ready to use	Pure
HMIS Rating	Health-Flammability-Reactivity	1 – 2 – 0