PCB Cleaners Vigon US
Model No: US
Boiling range 165-212°C
pH-value (10g/l H2O) 11.3
Cleaning temperature 40-60 °C
Flash point None
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VIGON® US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC Technology, VIGON® US removes all types of flux residues from electronic assemblies, flip chips packages and CMOS.

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 Advantages compared to other cleaners:

  • Due to its wide process window VIGON® US easily removes flux residues and solder pastes.
  • VIGON® US has no flash point and does not require explosion proof equipment.
  • The cleaning medium was specifically designed for the use in dip tank systems.
  • Due to its formulation, VIGON® US can be easily rinsed without leaving residues on the surface and provides low ionic contamination of cleaned parts.
  • Its high bath loading capacity ensures an extended bath life, low maintenance and reduced cleaning agent costs.
  • VIGON® US works exceptionally well for the cleaning in capillary spaces and is also suitable for cleaning under low standoff components.
  • Low odor.



Technical Data

Please note that the information below represents VIGON® US at 20 % concentration.


(g/ccm) at 20°C/68°F


Surface tension

(mN/m) at 25°C/77°F


Boiling range


165 – 212 / 329 – 414

Flash point




10g/l H2O


Vapor pressure

(mbar) 20°C/68°F


Cleaning temperature


40 – 60 / 104 – 140

Solubility in water



Application concentration 1

Concentrate in %

15 – 30

HMIS Rating


0 – 0 – 0

1 VIGON® US is recommended to be diluted with DI-water only.




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