PCB Cleaners Vigon US

Model No:	US
Boiling range	165-212°C
pH-value (10g/l H2O)	11.3
Cleaning temperature	40-60 °C
Flash point	None
TDS:	Download
MSDS:	Download

VIGON® US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC Technology, VIGON® US removes all types of flux residues from electronic assemblies, flip chips packages and CMOS.

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Advantages compared to other cleaners:

Due to its wide process window VIGON® US easily removes flux residues and solder pastes.
VIGON® US has no flash point and does not require explosion proof equipment.
The cleaning medium was specifically designed for the use in dip tank systems.
Due to its formulation, VIGON® US can be easily rinsed without leaving residues on the surface and provides low ionic contamination of cleaned parts.
Its high bath loading capacity ensures an extended bath life, low maintenance and reduced cleaning agent costs.
VIGON® US works exceptionally well for the cleaning in capillary spaces and is also suitable for cleaning under low standoff components.
Low odor.

Specification:

Technical Data Please note that the information below represents VIGON^® US at 20 % concentration.
Density	(g/ccm) at 20°C/68°F	0.99
Surface tension	(mN/m) at 25°C/77°F	30.8
Boiling range	°C/°F	165 – 212 / 329 – 414
Flash point	°C/°F	None
pH-value	10g/l H₂O	11.3
Vapor pressure	(mbar) 20°C/68°F	19
Cleaning temperature	°C/°F	40 – 60 / 104 – 140
Solubility in water		Soluble
Application concentration¹	Concentrate in %	15 – 30
HMIS Rating	Health-Flammability-Reactivity	0 – 0 – 0
¹ VIGON^® US is recommended to be diluted with DI-water only.