Maintenance Vigon RC 303
Model No: RC303
Boiling range 99°C
pH-value (10g/l H2O) 10.1
Cleaning temperature 20 - 50 °C
Vapor pressure Approx. 22 (mbar) at 20°C
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VIGON® RC 303 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensed fluxes and emissions from assemblies. As the successor to VIGON® RC 101, VIGON® RC 303 delivers an improved cleaning performance with the same high level of operator safety.

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 Advantages compared to other cleaning agents:

  • Higher cleaning quality and process reliability
    • Improved cleaning performance
    • The medium does not contain any ingredients which could leave residues on the oven surfaces. This avoids harmful condensation on the assembly surfaces after restarts.
    • Excellent material compatibility with aluminum and epoxy surfaces
  • Mild formulation
    • No flash point
    • High operator safety
    • Environmentally friendly
    • No special labeling is required
    • Little odor
  • More efficient cleaning process to avoid long machine downtimes
    • Short soaking time due to advanced formulation
    • Can be applied directly onto cold or warm surfaces (20 - 50 °C / 68 - 122 °F)
    • Also suitable for the pre-cleaning of condensation traps



Technical Data


(g/ccm) at 20°C/68°C


Surface tension

(mN/m) at 25°C/77°F


Boiling range


> 99/ > 210.2

Flash point




10g/l H2O


Vapor pressure

(mbar) at 20°C/68°F

Approx. 22

Cleaning temperature


20 – 50 / 68 – 122

Solubility in water



Application concentration



HMIS Rating


0 – 0 – 0