Maintenance Vigon RC 303

Model No:	RC303
Boiling range	99°C
pH-value (10g/l H2O)	10.1
Cleaning temperature	20 - 50 °C
Vapor pressure	Approx. 22 (mbar) at 20°C
TDS:	Download

VIGON® RC 303 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensed fluxes and emissions from assemblies. As the successor to VIGON® RC 101, VIGON® RC 303 delivers an improved cleaning performance with the same high level of operator safety.

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Advantages compared to other cleaning agents:

Higher cleaning quality and process reliability
- Improved cleaning performance
- The medium does not contain any ingredients which could leave residues on the oven surfaces. This avoids harmful condensation on the assembly surfaces after restarts.
- Excellent material compatibility with aluminum and epoxy surfaces
Mild formulation
- No flash point
- High operator safety
- Environmentally friendly
- No special labeling is required
- Little odor
More efficient cleaning process to avoid long machine downtimes
- Short soaking time due to advanced formulation
- Can be applied directly onto cold or warm surfaces (20 - 50 °C / 68 - 122 °F)
- Also suitable for the pre-cleaning of condensation traps

Specification:

Technical Data
Density	(g/ccm) at 20°C/68°C	1,01
Surface tension	(mN/m) at 25°C/77°F	31,8
Boiling range	°C/°F	> 99/ > 210.2
Flash point	°C/°F	None
pH-value	10g/l H₂O	10.1
Vapor pressure	(mbar) at 20°C/68°F	Approx. 22
Cleaning temperature	°C/°F	20 – 50 / 68 – 122
Solubility in water		Soluble
Application concentration	Ready-to-use	Pure
HMIS Rating	Health/Flammability/Reactivity	0 – 0 – 0