Screen Cleaning Hydron SC 300
Model No: SC300
Boiling range 98 - 22 °C
pH-value (10g/l H2O) Neutral
Cleaning temperature 20 - 50 °C
Vapor pressure approx. 20 (mbar) at 20°C
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HYDRON® SC 300 is a water-based, single-phase cleaning agent for SMT stencils. The cleaning agent reliably removes solder pastes and SMT adhesives at room temperature and does not leave any adhesive pigment residues on the surface. HYDRON® SC 300 is recommended for cleaning and rinsing and dries residue-free.

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Advantages compared to other cleaners:

  • Excellent cleaning performance on solder pastes and SMT adhesives, does not leave any pigment residues.
  • Recommended for cleaning and rinsing.
  • Residue-free drying does not leave any streaks on stencils.
  • No foaming in spray-in-air systems, neither in the cleaning nor in the rinsing section, can also be used with water rinsing.
  • VOC content < 20 %, therefore no subject to approval.
  • Excellent material compatibility with stencils.
  • Water-based cleaner without flash point, no explosion-proof protection required.

 

Specification:

 Technical Data

 HYDRON® SC 300 is available as concentrate or ready-to-use solution.

 Please note that the information below represents HYDRON® SC 300 as a ready-to-use mixture.

 Density

(g/ccm) at 20°C

0,99

 Surface tension

(mN/m) at25°C

26,7

 Boiling range

°C

98 - 229

 Flash point

°C

None

 pH-value

10g/l H2O

Neutral

 Vapor pressure

(mbar) at 20°C

approx. 20

 Solubility in water

 

Soluble

 Cleaning temperature

°C

20 - 50

 Application concentration

Ready-to-use

Pure

 Application concentration1

Concentrate

20 %

 1 HYDRON® SC 300 is recommended to be diluted in DI-water.