Screen Cleaning Hydron SC 300

Model No:	SC300
Boiling range	98 - 229 °C
pH-value (10g/l H2O)	Neutral
Cleaning temperature	20 - 50 °C
Vapor pressure	approx. 20 (mbar) at 20°C
TDS:	Download

HYDRON® SC 300 is a water-based, single-phase cleaning agent for SMT stencils. The cleaning agent reliably removes solder pastes and SMT adhesives at room temperature and does not leave any adhesive pigment residues on the surface. HYDRON® SC 300 is recommended for cleaning and rinsing and dries residue-free.

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Advantages compared to other cleaners:

Excellent cleaning performance on solder pastes and SMT adhesives, does not leave any pigment residues.
Recommended for cleaning and rinsing.
Residue-free drying does not leave any streaks on stencils.
No foaming in spray-in-air systems, neither in the cleaning nor in the rinsing section, can also be used with water rinsing.
VOC content < 20 %, therefore no subject to approval.
Excellent material compatibility with stencils.
Water-based cleaner without flash point, no explosion-proof protection required.

Specification:

Technical Data HYDRON^® SC 300 is available as concentrate or ready-to-use solution. Please note that the information below represents HYDRON^® SC 300 as a ready-to-use mixture.
Density	(g/ccm) at 20°C	0,99
Surface tension	(mN/m) at25°C	26,7
Boiling range	°C	98 - 229
Flash point	°C	None
pH-value	10g/l H₂O	Neutral
Vapor pressure	(mbar) at 20°C	approx. 20
Solubility in water		Soluble
Cleaning temperature	°C	20 - 50
Application concentration	Ready-to-use	Pure
Application concentration¹	Concentrate	20 %
¹ HYDRON^® SC 300 is recommended to be diluted in DI-water.