Microbond Flux 5070
Model No: F5070
Fineness of grind < 30 ┬Ám
Viscosity range 150 - 450 kcps
Tackiness > 100 gf
TDS:  Download
MSDS:  Download

Microbond tacky fluxes are suited for pin transfer, printing or ball dipping application techniques. Microbond tacky fluxes are compliant with the RoHS and ELV regulations.

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NC5070 fluxes are compatible with automated flux application methods or for manual flux application. Prior to use, allow the cartridges to reach room temperature (minimum 2h) before opening. A few sweeping moves of the squeegee on the flux reservoir are recommended. Optimal results can be obtained by cleaning the flux reservoir every 8h. NC5070 fluxes are compatible with convection or infrared reflow techniques. Recommended peak temperature for eutectic Pb-containing solder bumps is 195°C to 220°C and 20 to 60 seconds above melting point for standard applications. Recommended peak temperature for Pb-free solder bumps is 240°C to 260°C and 20 to 60 seconds above melting point for standard applications.

  • Suited for lead free and lead containing bumps
  • Excellent wetting behavior
  • Perfect cleaning properties
  • Blue or amber color available


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Microbond Flux 5070 | Distributor | Supplier | Dealer | India