The solder pastes of the F381 AT Series comprise a ready-to-use homogeneous mixture with low odour characteristics, consisting of metal powders, binders, solvents, fluxes and thixotropic agents. This pastes have an outstanding wetting capability (they contain halogenated activators - bonded halogens only), and are ideal for applications where difficult-to-solder surfaces have to be joined.
The robustness of the pastes allows for high product yield even when dealing with pads and components that have batch to batch variations in solder ability. The robustness of the pastes allows for high product yield even when dealing with pads and components that have batch to batch variations in solder ability. The F 381 series of solder pastes displays low sensitivity to high temperature and humidity during printing. Consequently, the pastes have very long stencil life and can be used in printers with TCU (Temperature Control Unit – very strong ventilation). Their rheology is optimized to allow for excellent printing performance with narrow openings and an excellent first print after a long pause. They have very high green strengths and are suitable for machines with fast accelerations/decelerations.
Other Products in this Category
F381 Series
F352 Series