F640 Series

Model No:	F640
Melting Point	Sn95.5/Ag4/Cu0.5 = 217°C , Sn96.5/Ag3/Cu0.5 = 217°C
Density	Sn95.5/Ag4/Cu0.5 7,4 g/cc, Sn96.5/Ag3/Cu0.5 7,4 g/cc
TDS:	Download
MSDS:	Download

F 640 Solder Paste series is a state-of-the-art lead free no clean solder paste that promotes wetting and minimizes soldering defects.

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F 640 Solder Paste series is state of the art leads free no clean solder paste that promotes wetting and minimizes soldering defects. The F 640 flux system is specifically optimized for Sn/Ag/Cu alloy soldering. Extensive testing at customer locations has proven this paste to be capable of defect-free performance in the production environment. The F 640 Series exhibits minimal slump and has excellent print-after-wait performance. This formula provides superior performance on a variety of surfaces finishes and leaves behind a clear residue. Reflow can be accomplished in air or nitrogen.