Precise, accurate, reliable soldering of through-hole component in mixed boards with previously soldered SMT components. Reduce board processing time as compared with hand soldering. Reduce direct labor cost, decrease rework costs, increase consistency over hand soldering through-hole components.
PRODUCT SPECIFICATIONS:
Max. PCB Size
310 x 310mm (12" x 12")
Max. Clearance on Solder Side*
25mm (1")*
Max. Transport Speed
6m/min
Transport Angle
0°fixed
Position accuracy above fluxer, preheater, and solder nozzle
± 0.1mm (± 0.004")
Flux Tank
2L Stainless Steel & Fittings, including Flux Level Monitoring
Flux Speed Max.
Spray Width (Nozzle diameter 0.3mm)
3mm - 6mm (0.12" - 0.24")
100% IR Preheat
900W
Nozzles
Wettable, Special
Smallest Nozzle Diameter
4.0mm on Wettable Nozzles
Min. Neighbor Component Clearance*
1.5 - 3mm (0.06" - 0.12") depending on nozzle type*
Solder Capacity
Approx. 15kg (33 lbs.)
Max. Temperature
400°C (725°F)
Warm-up Time
Approx. 45 minutes
(N2 Supply) (bottles, tank, or generator suitable, supplied by user)
N2-covering over solder bath & pump unit
N2 Pressure
2 bar (30 psi)
N2 Consumption
0.8 to 1.7 CFM(23-49 liters/min) depending on nozzle shroud
Pressure
5.5 bar (80 psi)
Power
3 x 230/400V, N, PE, 50/60 Hz
Max. Power Consumption
2.5kW
Max. Fuse Rate
3 x 16A
Exhaust Power (supplied by customer)
150 m3/hour
Exhaust Duct
100mm (4") India.
Dimensions
Size Dimensions
1240mm L x 1050mm W x 1400mm H (48.8" x 41.3" x 55.1")
Weight
150kg (330 lbs.)
Other Products in this Category
ESS 500