SMT Adhesive Dispensing

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SMT Adhesive Dispensing (Jar) PD 955M

PD 955M is a thermosetting single-component, solvent-free polymer adhesive, developed especially for the surface mounting of SMT components

SMT Adhesive Dispensing (Syringe) PD 955M

The dispensing system must transfer uniform and precise adhesive height and dot shape at different volumes onto the surface of PCB solder ma

The adhesive dispensing process can be defined as the process of transferring adhesive onto the PCB solder mask in a position suitable for holding the later placed components until the PCB is wave soldered. In some cases, this process is also used to hold heavy components in the second pass of a double-sided reflow process.

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SMT Adhesive Dispensing