HumiSeal® 1C49 is a moisture curing, low viscosity, VOC-free silicone conformal coating which provides excellent moisture and environmental protection for printed circuit assemblies. HumiSeal® 1C49 is solvent free. The coating demonstrates outstanding flexibility, fluorescence under UV light for ease of inspection and can be repaired. HumiSeal® 1C49 can be cured at room or at elevated temperatures.
HumiSeal® 1C49 conformal coating is:
HumiSeal® 1C49 conformal coating has:
Application of HumiSeal® 1C49 Silicone Conformal Coating
Conformal coatings can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials. Users should perform adequate testing to confirm compatibility between the conformal coating and their particular assembly materials, process conditions and cleanliness level.
1C49 is designed for application without additional thinning. Solvents or other thinners should not be mixed with 1C49. 1C49 may be applied by spray, brushing, flow coating or dipping. The time required to reach a tack-free state is dependent on ambient conditions such as temperature and relative humidity. The processing guidelines contained in this document were obtained with an ambient relative humidity of 50%.
Specification:
Product Specification
Density, per ASTM D1475
0.97 ± 0.03 g/cm³
Min. Solids Content, % by weight per Fed-Std-141, Meth. 4044
95 %
Viscosity, per Fed-Std-141, Meth. 4287
9000 ± 1500 centipoise
VOC
0 grams/litre
Recommended Coating Thickness
50 – 200 microns
Drying Time to Handle per Fed-Std-141, Meth. 4061
3-5 hours
Recommended Curing Conditions
24 hrs @ RT or 20 min @ 76°C*
Time required to Reach Optimum Properties
7 days
Recommended Stripper
HumiSeal Stripper 1091
Shelf Life at Room Temperature, DOM
12 months
Thermal Shock, 50 cycles per MIL-I-46058C
-65°C to 200°C
Coefficient of Thermal Expansion – TMA
323 ppm /ºC above Tg
Glass Transition Temperature – DSC
< -65°C
Modulus – DMA
408 MPa @ -40ºC 1.6 MPa @ 25ºC 1.4 MPa @ 80ºC
Tensile, per ASTM D412
30-50 psi
Elongation, per ASTM D412
80-120 %
Flammability, per UL94
V-0
Dielectric Withstand Voltage, per MIL-I-46058C
>1500 volts
Dielectric Breakdown Voltage, per ASTM D149
7000 volts
Dielectric Constant, at 1MHz and 25°C per ASTM D150-98
2.5
Dissipation Factor, at 1MHz and 25°C per ASTM D150-98
0.01
Insulation Resistance, per MIL-I-46058C
5.0 x 1014 ohms (500TΩ)
Moisture Insulation Resistance, per MIL-I-46058C
1.0 x 1010 ohms (10GΩ)
Fungus Resistance, per ASTM G21
Passes
* Place an open pan of water in the oven during curing
Other Products in this Category
Silicones 1C51
Silicones 2A53