Tools for Detaching the Connections
  • 07 Aug 2017

Mechanics often need some tools to separate the connections or some small pins which cannot be separated by hand at the time of repair. So here is a solution, there are various desoldering tools available to make this work easier. In simple words, desoldering means removal of solder or the small metal parts from the circuit. Desoldering is mainly done to remove the unwanted component for repair or replacement.

Various tools are available in the form of guns, tweezers which helps to pull the alloy from the circuit. There are also various types of nozzles available like ZUKI, MIRAE etc. depending upon the shapes and sizes of nuts. These are used by the PC technicians for removing the solder from the mother board.

The various types of desoldering tools are:

1. DeSoldering braid comprising of the copper wire is used to molten the alloy.
2. Suction pumps are also available to suck away molten solder from the circuit.
3. Solder wick to melt the components and solder suck to suck the solder out.

Traditionally selective soldering machines were used to solder the parts. In this machine only one machine can be soldered at a time. But now new machines are introduced which are efficient in batch processing. That means simultaneously many machines can be soldered.

There are different techniques used for soldering such as through hole in which solders are sucked with a PCB connection. But whereas in Surface mounted the entire component is melted to remove the solder. Innovative products introduced in market in soldering tools are vacuum desolders. Razor blades, heat guns are also some desoldering tools where sucking or melting of solders are not possible. Pumps usually contain hot air through which the solders get oxidized and removed. It becomes impossible to remove IC chips from the circuit so in this case razor blade is used to remove these solders. The IC chips can also be removed by heat gun from circuit. In suction desoldering tool , on pressing the button piston creates the suction connection and separates the solder from the connection.