HumiSeal® 2A64 is a two component polyurethane conformal coating supplied as Parts A and B, suitable for general printed circuit board applications. HumiSeal® 2A64 is characterized by high solids and low viscosity for ease of application and processing, and it fluorescence under UV light for inspection purposes.
HumiSeal® 2A64 conformal coating is:
HumiSeal® 2A64 conformal coating has:
Application of HumiSeal® 2A64 Conformal Coating
Conformal coatings can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials. Users should perform adequate testing to confirm compatibility between the conformal coating and their particular assembly materials, process conditions and cleanliness level.
Mixing ratio of Part A to Part B is 1:1 by volume. Prior to application, HumiSeal® 2A64 Parts A and B should be thoroughly mixed until a homogenous blend is achieved. Vigorous mixing is not recommended. The mixed coating should be allowed to settle for 30 minutes prior to use so that any air bubbles formed during blending can escape.
Specification:
Properties of Mixed HumiSeal® 2A64
Density, per ASTM D1475
1.07 ± 0.03 g/cm3
Solids Content, % by weight per Fed-Std-141, Meth. 4044
55 ± 5 %
Viscosity, per Fed-Std-141, Meth. 4287
130 ± 50 centipoise
VOC
501 grams/litre
Recommended Coating Thickness
25 – 75 microns
Drying Time to Handle per Fed-Std-141, Meth. 4061
15 minutes
Optional Curing Conditions to Reach Optimum Properties
3 hrs @ 76°C
Recommended Thinner
HumiSeal® Thinner 64
Recommended Stripper
HumiSeal® Stripper 1072
Pot Life at Room Temperature
8 hours
Shelf Life at Room Temperature, DOM
12 months
Thermal Shock, 50 cycles per MIL-I-46058C
-65°C to 125°C
Coefficient of Thermal Expansion – TMA
82 ppm/°C Below Tg 255 ppm/°C Above Tg
Glass Transition Temperature – DSC
12°C
Modulus – DMA
4101 MPa @ -40ºC 2777 MPa @ 25ºC 2 MPa @ 80ºC
Flammability, per MIL-I-46058C
Self-Extinguishing
Dielectric Withstand Voltage, per MIL-I-46058C
>1500 volts
Dielectric Breakdown Voltage, per ASTM D149
3500 volts
Dielectric Constant, at 1MHz and 25°C per ASTM D150-98
3.5
Dissipation Factor, at 1MHz and 25°C per ASTM D150-98
0.024
Insulation Resistance, per MIL-I-46058C
4.5 x 1014 ohms (450TΩ)
Moisture Insulation Resistance, per MIL-I-46058C
4.8 x 1010 ohms (48GΩ)
Fungus Resistance, per ASTM G21
Passes
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