Phase modulation profiling technology (PMP) is used to achieve three-dimensional measurement of printed solder paste, which can greatly improve measurement accuracy while ensuring high-speed inspection.
Features
Technical Specifications
Technology Platform
Large Platform
Series
InSPlre/S/F/Herro/Ultra/B/I SERIES
Model
1200/1200plus/1500/2000plus
Measurement Principle
3D PSLM PMP
Measurements
3D White light PSLM PMP (Programmable Spatial Light Modulation phase measurement profilometry
Detection of Non-performing Types
Missing print, insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination
Lens Resolution
4.5µm/5µm/6µm/8µm/10µm/12µm/15µm/16µm/18µm/20µm
Accuracy
XY (resolution): 10µm
Repeatability
height: 1µm (4 Sigma) volume/area: <1% (4 Sigma)
Gage R&R
10%
Inspection Speed
According to the actual configuration
Quality of Inspection Head
3? (Standard 1, option 2,3)
Mark-point Detection Time
0.3sec/piece
Maximum Measuring Head
±550µm (±1200µm as option)
Maximum Measuring Height of PCB Wrap
±5mm
Minimum Pad Spacing
80µm/100μm/150µm/200µm
Minimum element
0201
Maximum loading PCB & Detection Size
1200x650mm (1200) 1500×500mm (1500) 2000x500 mm (2000)
Conveyor Setup
front orbit (back orbit as option)
PCB Transfer Detection
(Left to right or right to left)
Conveyor width adjustment
Manual & Automatic
Engineering statistics
Histogram; Xbar-R Chart; Xbar-S Chart; CP&CPK; %Gage Repeatability Data; SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data Import
support Gerber format (274x. 274d), manual Teach model); CAD X/Y, Part No., Package Type imput)
Operating system support
Windows 10 Professional (64 bit)
Equipment dimension & weight
W1900xD1320×H1480mm (1200), 1250kg
W1780xD1450×H1530mm(1200plus), 1630kg
W2120xD1320×H1530(1500plua), 1750kg
W2620xD1-450xH15:30 2000plus),2100Kg
Optional
One person controls more machines. Network SPC (Software only) ID/2D Barcode scanner, out-line programming software, UPS continuous power supply
Other Products in this Category
SPI InSPlre-510B